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High Speed and Low Temperature Cure Resins

 

Originally developed under a NASA program, the ATI-ROC™-P600, ATI-ROC™-T650, and the ATI-ROC™E37X1 are members of the “Rigidization on Command”™ (ROC) resin series.  They are formulated for fast curing or for use in situations where curing at low temperatures is required.  These systems utilize a conventional UV photoinitiator with an added conventional sensitizer and an accelerating compound to promote rapid cure under UV irradiation. ATI-ROC™-P600 is a slightly faster curing resin system.

Both systems are 100% solids UV-curing formulation featuring good durability, low shrinkage, low out

Optimum cure wavelength

254 nm (Hg emission line)
Hg vapor lamp most suitable for cure, long wave UV OK
Sunlight for illumination can be used as well
 

ATI-ROC™-KF05 is a member of the “Rigidization on Command”™ (ROC) resin series created for fast curing or for use in situations where curing at low temperatures is required.  This system features a polymeric sensitizer/accelerator used in conjunction with a conventional UV photoinitiator to promote rapid cure under UV irradiation.  ATI-ROC™-KF05 is the fastest of Adherent Technologies UV Curing ROC™ epoxy systems and has been used in inflatable booms.

ATI-ROC™-DBF3 was created for fast curing or for use in situations where curing at low temperatures is required.  This system has been specially formulated to cure under illumination with blue and green LEDs, and has been proven in inflatable booms.

ATI-ROC™-E37X1 UV Curing Acrylate resin is another member of the “Rigidization on Command”™ (ROC) resin series created for fast curing or for use in situations where curing at low temperatures is required.  This resin is especially for use in situations where very fast or "snap" cures are required.

 

Contact and Sales

For additional information on “Rigidization on Command”™ resin systems, please contact 

Andrea Hoyt, PhD
(Polymer Projects Manager) Development Laboratories
11208 Cochiti SE
Albuquerque, NM 87123 

Resins@adherent-tech

 

 

 

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Copyright © 2008 Adherent Technologies, Inc.
Last modified: May 16, 2008

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