Composites Technologies

Fiber Finish Systems

Adherent Technologies offers a line of cutting edge fiber finish systems based on a proprietary reactive coupling agent technology that provides covalent bonding to both the fiber and to the matrix resin.  This technology significantly improves fiber/matrix interface properties leading to enhanced durability, thermal stability, and hot/wet properties.  This technology is compatible with a wide range of fiber and matrix materials.

To date, ATI's fiber finishes have been demonstrated with epoxies, vinyl esters, bismaleimides, and polyimides.  

Contact us if you would like us to evaluate your resin system.

90° Flex Fracture Surfaces of a Carbon/Vinyl Ester Composite Using Commercially Sized Fibers (left)
or Adherent Technologies' Vinyl Ester Compatible Finished Fibers

Powder Towpreg

Adherent Technologies has developed a high-speed process for the production of high-quality powder towpregs.  ATI's powder towpreg systems feature highly uniform distribution of the polymer powder throughout the tow, leading to better consolidation in fabrication processes including filament winding and automated tow or tape placement.  Reduced cycle times for the production of polyimide matrix parts using ATI's powder towpreg have been demonstrated.

High quality powder towpreg has been manufactured using a variety of thermoset and thermoplastic polymer powders including polyimide, bismaleimide, epoxy, polypropylene, polystyrene, and nylon.

Contact us for further information on this process 

Polyimide Powder Towpreg  (approximately 35% polymer loading)	Ducts Fabricated with Non-autoclave Cure  Slit Tape, Left and Powder Towpreg, Right  (photo courtesy of Vought Aircraft)

Composite Recycling

Adherent Technologies offers the only commercially available composite recycling systems that  are both environmentally friendly and economical.  Recovered chopped or milled carbon fiber exhibits properties identical to virgin material.

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Copyright © 2008 Adherent Technologies, Inc.
Last modified: May 16, 2008